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S-parameter two port RF and microwave circuit simulation is not implemented in traditional SPICE 2g6 and 3f5 simulators.This is a serious omission because at RF frequencies S-parameter and other two-port network parameters are widely used in circuit analysis and design.To overcome this limitation four small signal AC analysis probes have been added to the spice4qucs RF extensions. When combined with signal sourcesthey form a Two-port S-parameter circuit test bench. This test bench is shown in Figure 13.1. Its main features are space on the test benchschematic to place the device under test (DUT) circuit diagram, input AC signal sources with \(Z_0\) characteristic impedance, \(Z_0\) loadimpedances and the S-parameter measurement probes. Notice that two copies of the DUT are require; firstly to measure \(S_{11}\) and \(S_{12}\) andsecondly \(S_{22}\) and \(S_{21}\). The test bench also includes a detailed set of instructions on how to use it to measure simulated two-port S-parameters.The two-port S-parameter test bench illustrated in Figure 13.1 will work with the Ngspice, Xyce and SPICE OPUS circuit simulators.
The Spice4qucs subsystem supports Xyce single tone and multi-tone Harmonic Balance (HB).Unlike the rudimentary version of HB simulation implemented in Qucs the Xyce version can simulate circuitswith a full range of SPICE components. It is also faster and much more stable. In general no changes to the SPICEsemiconductor device or component models are required. To invoke single tone HB just placethe Qucs-S HB simulation icon on a circuit schematic, define the number of harmonics andsimulate the circuit with Xyce. The spice4qucs output data parser automatically converts output variable names to Qucs notation.For example, for node voltage out plot out.Vb.
Abstract:The device library in the standard circuit simulator (SPICE) lacks a gallium nitride based high-electron-mobility-transistor (GaN-HEMT) model, required for the design and verification of power-electronic circuits. This paper shows that GaN-HEMTs can be modeled by selected equations from the standard MOSFET LEVEL 3 model in SPICE. A method is proposed for the extraction of SPICE parameters in these equations. The selected equations and the proposed parameter-extraction method are verified with measured static and dynamic characteristics of commercial GaN-HEMTs. Furthermore, a double pulse test is performed in LTSpice and compared to its manufacturer model to demonstrate the effectiveness of the MOSFET LEVEL 3 model. The advantage of the proposed approach to use the MOSFET LEVEL 3 model, in comparison to the alternative behavioral-based model provided by some manufacturers, is that users can apply the proposed method to adjust the parameters of the MOSFET LEVEL 3 model for the case of manufacturers who do not provide SPICE models for their HEMTs.Keywords: gallium nitride (GaN); modeling; MOSFET equations; power HEMTs; parameter extraction; semiconductor device modeling; SPICE equations; SPICE simulator
For a circuit simulator to be a useful circuit design aid it must be able to simulatea range of analogue and digital circuits which include passive components, semiconductor devices,integrated circuits and non-electrical devices when needed. By combining Qucs with ngspice and Xycethe number of available simulation models has increased significantly, making the spice4qucs versionof Qucs more flexible and powerful, when compared to earlier Qucs releases.One of the primary motives behind the development of spice4qucs was to provide Qucsusers with access to published SPICE component models while keeping all the existing Qucs models and simulationcapabilities unchanged. With the first release of spice4qucs, as Qucs-0.0.19S, this aim has largelybeen achieved. However, there are still significant gaps in the Qucs-0.0.19S simulation capabilities(for example no SPICE 3f5 .PZ simulation yet) and model coverage (for example thenumber of power analogue and digital models are limited). More work is planned on model developmentfor later releases of the software, including improvements to power device models and the introduction ofXSPICE digital models for true mixed-mode analogue-digital simulation. Any improvements and additionsto the Qucs-0.0.19S model complement will be recorded in this document as they are introduced by theQucs Development Team.
No two circuit simulators are equipped with an identical number, and the same identical types, of circuit simulation models.This is even true with the various implementations of SPICE developed from SPICE 3f5. Hence, by combining Qucs, ngspice andXyce within onecircuit simulation software package there has to be a way of identifying which models work with which simulator.A second feature that further complicates model selection is the fact that supposedly identical models representingthe same generic device, for example a BJT, may be based on different physical device equations and a different numberof device parameters. In an attempt to identify which model works with which simulator the Qucs Development Team haveadopted the following model symbol colouring scheme; existing Qucs models are coloured dark blue (no change),SPICE models which work with both ngspice and Xyce are coloured red, SPICE modelsthat only work with ngspice are coloured cyan and SPICE models that only work with Xyce are coloured dark green. This schemeis not perfect because a number of the original Qucs models also work with ngspice and Xyce. However, for legacy reasons theQucs Development Team has decided not to change the colours of these models at this time. This decision will probably bereviewed in later releases of Qucs.
The ion-sensitive field-effect transistor (ISFET) is a popular technology utilized for pH sensing applications. In this work, we have presented the fabrication, characterization, and electrochemical modeling of an aluminum oxide (Al2O3)-gate ISFET-based pH sensor. The sensor is fabricated using well-established metal-oxide-semiconductor (MOS) unit processes with five steps of photolithography, and the sensing film is patterned using the lift-off process. The Al2O3 sensing film is deposited over the gate area using pulsed-DC magnetron-assisted reactive sputtering technique in order to improve the sensor performance. The material characterization of sensing film has been done using x-ray diffraction, field-emission scanning electron microscopy, energy-dispersive spectroscopy, and x-ray photoelectron spectroscopy techniques. The sensor has been packaged using thick-film technology and encapsulated by a dam-and-fill approach. The packaged device has been tested in various pH buffer solutions, and a sensitivity of nearly 42.1 mV/pH has been achieved. A simulation program with integrated circuit emphasis (SPICE) macromodel of the Al2O3-gate ISFET is empirically derived from the experimental results, and the extracted electrochemical parameters have been reported. The drift and hysteresis characteristics of the Al2O3-gate ISFET were also studied, and the obtained drift rates for different pH buffer solutions of 4, 7, and 10 are 0.136 μA/min, 0.124 μA/min, and 0.108 μA/min, respectively. A hysteresis of nearly 5.806 μA has been obtained. The developed sensor has high sensitivity along with low drift and hysteresis.
A reprint of the classic text, this book popularized compact modeling of electronic and semiconductor devices and components for college and graduate-school classrooms, and manufacturing engineering, over a decade ago. The first comprehensive book on MOS transistor compact modeling, it was the most cited among similar books in the area and remains the most frequently cited today. The coverage is device-physics based and continues to be relevant to the latest advances in MOS transistor modeling. This is also the only book that discusses in detail how to measure device model parameters required for circuit simulations.
The book deals with the MOS Field Effect Transistor (MOSFET) models that are derived from basic semiconductor theory. Various models are developed, ranging from simple to more sophisticated models that take into account new physical effects observed in submicron transistors used in today's (1993) MOS VLSI technology. The assumptions used to arrive at the models are emphasized so that the accuracy of the models in describing the device characteristics are clearly understood. Due to the importance of designing reliable circuits, device reliability models are also covered. Understanding these models is essential when designing circuits for state-of-the-art MOS ICs.
All industry standard compact models released by Si2 Compact Model Coalition (CMC) as well as compact models of emerging nano-electronics devices released by New Era Electronic Devices and Systems (NEEDS) initiative are coded in Verilog-A. This book prepares you for the current trends in the neuromorphic computing, hardware customization for artificial intelligence applications as well as circuit design for internet of things (IOT) will only increase the need for analog simulation modeling and make Verilog-A even more important as a multi-domain component-oriented modeling language.
Passive components with reference matching a device type in Spice notation (R** for resistors, C* for capacitors, L** for inductors) will have models assigned implicitly and use the value field to determine their properties.
Computational electromagnetics (CEM) is the process of modeling the interaction of electromagnetic fields with physical objects and the environment. This book provides an overview of the three main full-wave numerical methods in computational electromagnetics: the method of moment (MoM), the finite element method (FEM), and the finite-difference time-domain (FDTD) method. The authors elaborate on the above three methods in CEM using practical methods, explaining their own research experiences along with a review of current literature. A full analysis is provided for typical cases, including characteristics of numerical methods, helping beginners develop a quick and deep understanding of the essentials of CEM. 2b1af7f3a8